| 摘要 |
A multi-chip package with a LOC lead frame is disclosed. Such a LOC lead frame has a plurality of leads, with each lead from inside to outside being divided into a first inner portion, a supporting portion, a second inner portion and an outer connecting portion. By bending the leads, the first inner portion, the supporting portion, and the second inner portion are formed on different planes. The first inner portion is sticking to the bottom chip and enables the electrical connection to the bottom chip. The supporting portion is sticking to the upper chip, while the second inner portion enables the bonding wires electrically connect the upper chip. This design can pack the upper and the bottom chips with a LOC lead frame without turnover action during wire-bonding.
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