发明名称 Microelectronic fabrication tool loading method providing enhanced microelectronic fabrication tool operating efficiency
摘要 Within a method for operating a fabrication tool which requires transfer of a series substrates from a storage carrier to a process carrier when fabricating the series of substrates within the process carrier within the fabrication tool, a specific series of substrates is transferred from a storage carrier to a process carrier (and/or the reverse) simultaneously with fabricating a separate series of substrates within a process carrier within the fabrication tool. By employing the method, the fabrication tool may be operated more efficiently.
申请公布号 US2002154988(A1) 申请公布日期 2002.10.24
申请号 US20010837074 申请日期 2001.04.18
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHEN YIAU-HWEUI;CHIU KERRY;CHEN RAYMOND;HUANG LARRY
分类号 H01L21/00;H01L21/677;(IPC1-7):B65B69/00 主分类号 H01L21/00
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