发明名称 |
Semiconductor chip assemblies, methods of making same and components for same |
摘要 |
Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.
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申请公布号 |
US2002155728(A1) |
申请公布日期 |
2002.10.24 |
申请号 |
US20020164116 |
申请日期 |
2002.06.05 |
申请人 |
TESSERA, INC. |
发明人 |
KHANDROS IGOR Y.;DISTEFANO THOMAS H. |
分类号 |
H01L21/60;H01L21/822;H01L21/98;H01L23/13;H01L23/31;H01L23/485;H01L23/498;H01L23/58;H01L25/16;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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