发明名称 |
Land grid array semiconductor device and method of mounting land grid array semiconductor devices |
摘要 |
A main object of the present invention is to provide a land grid array type semiconductor device which has been improved to provide greater positioning accuracy for an external electrode with respect to a mounting substrate. An external electrode is arranged in one surface of a substrate in area array. The external electrode includes an external electrode pad and an external electrode interconnection. The external electrode pad includes a first pad layer formed in a cylinder shape and a second pad layer formed to cover the surface of the first pad layer in a cone shape.
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申请公布号 |
US2002153608(A1) |
申请公布日期 |
2002.10.24 |
申请号 |
US20010983127 |
申请日期 |
2001.10.23 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OKADA MAKIO;KASATANI YASUSHI;HASHIMOTO TOMOAKI |
分类号 |
H01L23/12;H01L21/52;H01L23/498;H05K1/11;H05K3/32;H05K3/34;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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