Production of a semiconductor component which emits and receives radiation used in optical devices comprises forming and preparing an electrical leadframe, and further processing

摘要

Production of a semiconductor component which emits and receives radiation comprises forming and preparing an electrical leadframe (2); mounting a chip (5) ; placing an injection mold on the lead frame so that the semiconductor chip lies in a chip cavity of a molding stamp of the mold for a radiation window (8); extruding the leadframe with a housing base body (1); and encapsulating the chip. Production of a semiconductor component which emits and receives radiation comprises forming and preparing an electrical leadframe (2) having a chip assembly region, a wire connecting region (10) and external electrical connecting strips (3a, 3b); mounting a chip (5) which emits and receives radiation on the chip assembly region using a thermally conducting connecting material having a melting temperature above the solder temperature of the subsequent component steps; placing an injection mold on the lead frame so that the semiconductor chip lies in a chip cavity of a molding stamp of the mold for a radiation window (8); extruding the leadframe with a housing base body (1) so that the semiconductor chip is arranged in the window; and encapsulating the chip. An Independent claim is also included for a semiconductor component produced. Preferred Features: The connecting material is a hard solder. The melting point of the connecting material is 260 deg C or more. The chip is surrounded by a plastic composition.