METHOD AND APPARATUS FOR ELECTROCHEMICALLY DEPOSITING A MATERIAL ONTO A WORKPIECE SURFACE

摘要

An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.