发明名称 Method and device for coupling PCB sheet
摘要 A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2' is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2', the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2' is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.
申请公布号 US2002152609(A1) 申请公布日期 2002.10.24
申请号 US20020177664 申请日期 2002.06.24
申请人 发明人 CHOI BONG KYU;CHOI CHUN HO
分类号 H05K1/14;B01F5/10;B01F11/00;B01F13/00;B01L3/02;G01N35/10;H01L21/00;H01L21/48;H05K1/02;H05K3/00;H05K3/22;H05K3/36;(IPC1-7):H05K3/36;B23P19/00 主分类号 H05K1/14
代理机构 代理人
主权项
地址