发明名称 |
Method and device for coupling PCB sheet |
摘要 |
A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2' is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2', the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2' is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.
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申请公布号 |
US2002152609(A1) |
申请公布日期 |
2002.10.24 |
申请号 |
US20020177664 |
申请日期 |
2002.06.24 |
申请人 |
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发明人 |
CHOI BONG KYU;CHOI CHUN HO |
分类号 |
H05K1/14;B01F5/10;B01F11/00;B01F13/00;B01L3/02;G01N35/10;H01L21/00;H01L21/48;H05K1/02;H05K3/00;H05K3/22;H05K3/36;(IPC1-7):H05K3/36;B23P19/00 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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