发明名称 Method of manufacturing semiconductor devices with use of wafer carrier having conditioning units
摘要 A method of manufacturing semiconductor devices uses a wafer carrier having conditioning units to control internal conditions of the wafer carrier. The wafer carrier stores and carries wafers between manufacturing equipments used in manufacturing processes. For each of the manufacturing processes, the method includes placing the wafer carrier on a load port, transferring the wafers from the wafer carrier into the manufacturing equipment through the load port, changing operating conditions of the conditioning units according to the process or test being carried out by the manufacturing equipment, returning the wafers into the wafer carrier through the load port after the completion of the process or test, and operating the conditioning units according to the changed operating conditions to control the internal conditions until the wafer carrier is carried to the next manufacturing equipment.
申请公布号 US2002155647(A1) 申请公布日期 2002.10.24
申请号 US20020067948 申请日期 2002.02.08
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NISHIKI KAZUHIRO
分类号 B65D85/86;B65G49/00;B65G49/07;H01L21/00;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):H01L21/00 主分类号 B65D85/86
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