发明名称 |
Retaining ring of a wafer carrier |
摘要 |
A retaining ring of a wafer carrier includes a polymer containing abrasives. The abrasives can be released from the polymer by the friction between the polymer and the polishing pad. Therefore, it is convenient to maintain the wafer and is possible to prevent abrasives from aggregating in the polishing slurry. Meanwhile, the time for replacing the polishing slurry can be reduced and the polishing operation as a whole can be simplified so as to reduce the cost and promote productive efficiency.
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申请公布号 |
US2002155797(A1) |
申请公布日期 |
2002.10.24 |
申请号 |
US20010837168 |
申请日期 |
2001.04.19 |
申请人 |
KUO CHIA-MING;HUANG CHAO-YUAN |
发明人 |
KUO CHIA-MING;HUANG CHAO-YUAN |
分类号 |
B24B37/04;B24B53/007;(IPC1-7):B24B7/22 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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