发明名称 WALL STRUCTURE CONDUCTING HEAT INSULATION AND HEAT TRANSFER
摘要 <p>PROBLEM TO BE SOLVED: To adjust and indoor section at a proper temperature by changing a wall structure into a heat-insulating wall body or a heat-transfer wall body. SOLUTION: The wall structure 20 has high thermal conductive plates 7 forming isothermal surfaces crossed at right angles with the heat-flow direction and directed and arranged, low thermal conductive lattice bodies composed of vertical plates 8 and horizontal plates 9 forming cellular spaces extending in the thickness direction vertically to the surfaces of the plates 7, and a hollow wall body 3 consisting of an external plate 5 and an internal plate 4 partitioning an indoor section 1 and an outdoor section 2. The wall structure 20 functions as a heat-insulating wall body under the closed state of opening sections 10 and 11 by shutters 12 and 13, and flow paths 17 are formed by pivotal moving centering around fulcra 14 of the horizontal plates 9 under the open state of the opening sections 10 and 11 and functions as a heat-transfer wall body.</p>
申请公布号 JP2002309689(A) 申请公布日期 2002.10.23
申请号 JP20010119354 申请日期 2001.04.18
申请人 FUKUOKA PREF GOV SANGYO KAGAKU GIJUTSU SHINKO ZAIDAN;MASUOKA TAKASHI;TANIGAWA HIROFUMI;FUKUOKA PREFECTURE;SHOWA MFG CO LTD;ARUMU:KK;SADENKO CO INC 发明人 MASUOKA TAKASHI;TANIGAWA HIROFUMI;NAKAMURA HIROAKI;ONISHI MITSUHARU;UDA SHINJI;SHIMADA YOSHIMITSU
分类号 E04B1/74;E04B2/14;(IPC1-7):E04B1/74 主分类号 E04B1/74
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