| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition excellent in contact properties, heat resistance, electrical characteristics, chemical resistance, operability, low dielectric permittivity and capable of being used for the substrate of a printed-circuit base board (laminated sheet and metal-clad laminated sheet) and a resin coated metal foil. SOLUTION: A thermosetting resin composition is obtained by adding 0.1-1000 pts.wt. of (2) a silicon-containing polyimide having >=95 mol% and <=100 mol% ring closure % of imide rings and 0.005-5 pts.wt. of (3) a thermosetting catalyst as essential ingredients to 100 pts.wt. of (1) a polyfunctional cyanate ester compound or a prepolymer of the cyanate ester.
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