发明名称 ADHESION MEASURING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To measure adhesion applied to an object at high precision by correct ly measuring sound pressure strength. SOLUTION: An ultrasonic vibrator 4 generates ultrasonic waves based on a sine wave AC voltage amplified by a high speed amplifier 3. Sound radiation force in a loop direction of sound pressure is applied on particle 22, and force is generated in a direction of a horn 5. An amplifier 63 measures sound pressure strength corresponding to vibration of a probe 61, and result of measurement is supplied to an arithmetic unit 7. The arithmetic unit 7 computes adhesion generated at the particle 22 using the sound pressure strength A from the sound pressure measuring device 6 and other parameters.
申请公布号 JP2002311003(A) 申请公布日期 2002.10.23
申请号 JP20010115492 申请日期 2001.04.13
申请人 FUJI XEROX CO LTD 发明人 MUKAI HIROKAZU
分类号 G01N29/00;G01N19/04;(IPC1-7):G01N29/20 主分类号 G01N29/00
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