| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive film which can introduce simply an insulating layer of high dielectric capacity onto a multilayer printed circuit board by a vacuum laminator and be plated onto the insulating layer of high dielectric capacity. SOLUTION: This adhesive film comprises being layered with an epoxy resin composition containing components (A)-(D): (A) an aromatic epoxy resin being liquid at an ordinary temperature having two or more epoxy groups in a molecule; (B) an epoxy curing agent; (C) a phenoxy resin having weight- average molecular weight of 5,000 to 100,000; and (D) an inorganic filler of a high dielectric constant, on a supporting base film, wherein a specific dielectric constant after heat-curing of the epoxy resin composition is 10 or more.</p> |
