| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a vacuum heat insulation structure with excellent gas barrier property, heat resistance and pin-hole resistance. SOLUTION: In the vacuum heat insulation structure in which heat insulation substance is filled in a bag formed of a multi-layered film having a thermoplastic resin layer for an outermost layer, a gas barrier layer for an intermediate layer and a heat seal layer for an innermost layer, and the heat seal layers thereof heat-sealed to each other, and an opening part is heat-sealed, the gas barrier layer is formed of an oriented film formed of resin composition consisting of, 70-95 wt.% barrier property resin (A) and 5-30 wt.% inorganic filler (B) of the grain size of 0.5-2.5μm, and a metal is vacuum vapor-deposited on the outer layer side of the oriented film.</p> |
