发明名称 ROTARY TYPE COMPRESSION MOLDING MACHINE FOR IC-SEALING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a rotary type compression molding machine capable of avoiding fusion bonding of an IC-sealing resin, which is good in fluidity and fusible, to a turn table or a channel-controlling weir part and carrying out stable molding. SOLUTION: In the rotary type compression molding machine for compression molding by continuously feeding IC-sealing resin powder, a contact area of an IC-sealing resin powder channel controlling weir part (an immovable part) fixed to an apparatus to the turn table is (3 to 20)×10<-3> m<2> , a clearance other than the contact part is 3 mm or less, at least one sheet of the weir in the channel controlling weir part at a lower punch descent the lowest point in a mold is established, and an outer peripheral speed of the turn table is 0.2 to 2 m/s.
申请公布号 JP2002307429(A) 申请公布日期 2002.10.23
申请号 JP20010111567 申请日期 2001.04.10
申请人 TORAY IND INC 发明人 TACHIBANA KUNIHIKO;KAWAKITA YOSHIO;YUKI YOSHIKIMI
分类号 B30B11/08;B29B9/10;B29K63/00;(IPC1-7):B29B9/10 主分类号 B30B11/08
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