| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding paste curable without forming voids in the cured paste and capable of keeping the uniform coating film thickness of the paste. SOLUTION: The die bonding paste contains (A) an epoxy resin, (B) a hardener for the epoxy resin, (C) a filler having an average particle diameter smaller than the diameter of the component D mentioned below and (D) a spherical thermoplastic organic filler having an average particle diameter of 10-80μm, a particle size distribution of <=±5μm and a melting point of 50-200 deg.C as essential components. The content of the thermoplastic organic filler D is 0.1-10 wt.% based on the sum of the components A, B and C.
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