发明名称 PLASMA TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide plasma treatment equipment with which a high-quality treatment can be carried out at a high speed. SOLUTION: This plasma treatment equipment has a cathode 2, a high-frequency power source 5 connected thereto, a magnetron magnetic field generating means (magnet 20) near the cathode 2 and means (coil 21) of decreasing a cathode sheath voltage VS.
申请公布号 JP2002309374(A) 申请公布日期 2002.10.23
申请号 JP20010116087 申请日期 2001.04.13
申请人 TDK CORP;TAKAMURA SHUICHI 发明人 MOROOKA HISAO;TAKAMURA SHUICHI;UESUGI YOSHIHIKO;ONO TETSUYASU
分类号 H05H1/46;B01J19/08;C23C16/509;H01L21/205;H01L21/302;H01L21/3065 主分类号 H05H1/46
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