| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device and method capable of obtaining stability of a polishing speed and excellent flatness, and excellently reducing defects (scratches) generated on a polishing face of a polishing target object such as a semiconductor wafer to various kinds of the polishing target objects. SOLUTION: This polishing device polishes the polishing target object through abrasive grains by pressing the polishing target object onto a polishing instrument 1 and sliding the polishing target object. The polishing instrument 1 includes a highly water absorptive material 5. As the high water absorptive material 5, polyacrylic acid, polyvinyl acetal, polyvinyl pyrralidone, polyvinyl alcohol, polyethylene imine, polyethylene oxide, a styrene-maleic anhydride copolymer, polyvinyl amine, polyallylamine, an oxazoline group-containing water-soluble resin, a water-soluble melamine resin, a water-soluble urea resin, an alkyd resin, sulfonamide or the like can be used. |
