POLISHING DEVICE, POLISHING PAD, POLISHING METHOD AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To selectively radiate polishing heat generated in a polishing pad to improve in-surface temperature uniformity of a substrate, and to improve in-surface uniformity of a polishing rate. SOLUTION: In this polishing device, cooling water piping 6 cools a surface plate 5. The polishing pad 1 disposed on the surface plate 5 includes a base member and metal particles 11 having expansibility and heat conductivity higher than the base member. In the polishing pad 1, because the metal particles 11 in a high-temperature part thermally expand to contact with each other, the heat conductivity is variable.