发明名称 RESIN COMPOSITION, SOLDERING RESIST RESIN COMPOSITION AND THEIR CURED MATERIALS
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition which gives a cured material excellent in flexibility, resistance to soldering heat, heat aging resistance and resistances to electroless tinning and gilding, can realize the development with a dilute alkaline solution, and is suitable for a soldering resist and an interlaminar insulating layer. SOLUTION: The resin composition contains a polycarboxylic acid resin (A) containing an ethylenically unsaturated group, a diluent (B), and an epoxy resin (C) modified with a polysulfide.
申请公布号 JP2002308966(A) 申请公布日期 2002.10.23
申请号 JP20010109630 申请日期 2001.04.09
申请人 NIPPON KAYAKU CO LTD 发明人 KOYANAGI TAKAO;OZAKI TORU;YOKOSHIMA MINORU
分类号 C08G59/20;C08G59/14;H05K3/00;H05K3/28;H05K3/46;(IPC1-7):C08G59/20 主分类号 C08G59/20
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