| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable for use as a soldering resist for electroless gold plating excellent in resistance to the heat of soldering, electric insulating property, electric corrosion resistance, flame resistance and resolution and to provide a photosensitive film having a layer of the photosensitive resin composition capable of ensuring simultaneous adhesion of both faces to substrates by a laminator without carrying out a drying step and a base film. SOLUTION: The photosensitive resin composition is composed of a resin composition obtained by reacting hydroxyl groups in a phosphorus-containing phenoxy resin with a saturated or unsaturated polybasic acid anhydride, a photopolymerizable unsaturated compound containing at least one terminal ethylenically unsaturated group and a photopolymerization initiator. The photosensitive film consists of a layer of the photosensitive resin composition and a support film supporting the layer and a peelable cover film may further be disposed on the photosensitive resin composition layer of the photosensitive film. |
