| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which does not require to use a plating liquid mixed with an additive and having a simplified structure, and a plating method. SOLUTION: A base plate to be treated is placed on a stand with the treating surface upward and a seal member is stood on the base plate and is brought into contact with the center part of the base plate. A fluid is brown to the periphery of the base plate from the under side to form a fluid wall. As a result, a liquid reservoir is formed from the center part of the base plate and the seal member or the fluid wall. The additive is supplied to the reservoir, the treating part is coated with the additive and the plating liquid is supplied thereon.
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