发明名称 CUTTING DEVICE AND CUTTING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a cutting device and a cutting method using the same capable of manufacturing good parts at a high working efficiency, securing stability by positioning a center of gravity of the whole device in a lower side, and improving an outer appearance of the whole device, without peeling off of material A to be processed or generation of burr. SOLUTION: This invention relates to a device for a cutting process of the material A to be processed. The device is provided with a upper board 3 having a cutting edge 2 for cutting the material A to be processed attached in a lower part side, an intermediate board 4 arranged in the lower side of the upper board 3 and movably supporting a table 7 having the material A to be processed mounted on, and a lower board 5 arranged in the lower part side of the intermediate board 4. The upper board 3 and the lower board 5 are connected with a left and right pair of column materials 6 and the intermediate board 4 is supported in midair by a groundside frame 8. A drive mechanism 9 reciprocating the upper board 3, the lower board 5, and the intermediate board 4 in a vertical direction is arranged between the intermediate board 4 and the lower board 5.
申请公布号 JP2002307374(A) 申请公布日期 2002.10.23
申请号 JP20010111223 申请日期 2001.04.10
申请人 SAKAMOTO ZOKI KK 发明人 SAKAMOTO HARUKI
分类号 B26D5/08;B26D1/08;(IPC1-7):B26D1/08 主分类号 B26D5/08
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