| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiation inspection system, as an inspection system using a radiation, in which a large-scale image processing operation is not required as different from conventional cases, in which hardware and software for the image processing operation can be made comparatively simple and by which a crack and a chip in a product packaged by an optically opaque material or the like can be determined at low costs and surely. SOLUTION: Regarding pixel data from a radiation detection means 3, a difference from the pixel data in the circumference is computed, the number of pixels whose density data according to the difference is situated within preset ranges XL to XH is integrated, the total of circumferential lengths of an object WA to be inspected is obtained, and whether the crack and the chip exist or not is determined on the basis of its value. Without performing the pattern recognition or the like of a radiation penetration image, whether the crack and the chip exist in the object WA to be inspected can be determined precisely by a simple data processing operation. |
