| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor reliable to repeated pressure load and temperature change under actual conditions. SOLUTION: This semiconductor pressure sensor comprises a semiconductor chip 1 for converting the pressure change of a measuring medium to an electric signal, a resin case 4 having a recessed part 11 for housing the semiconductor chip 1 and a lead terminal 7 allowing the periphery of the recessed part to communicate with the outside, a holding member 3 for fixing the semiconductor chip 1 to the resin case 4, a bonding wire 5 for electrically connecting the semiconductor chip 1 to the lead terminal 7, and a coating member 8 for at least partially covering the semiconductor hip 1 and the bonding wire 5. When the penetration H of the coating member 8 is 15 to 40, and the sectional area of the gap of the semiconductor chip 1 and holding member 3 with the recessed part of the resin case 4 is S (mm<2> ), the relation of S<=0.37 Loge (0.69H) is satisfied.
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