| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which excels in photosensitivity, excels in the flexibility and soldering heat resistance, resistance to heat deterioration, and electroless gold plating resistance of cured products, can be developed with a dilute alkali solution, and is suited in use for solider resists and interlaminar insulating layers. SOLUTION: The resin composition comprises (A) a maleimide group- containing polycarboxylic acid urethane resin obtained by reacting (c) a reaction product of (a) an epoxy resin having two epoxy groups in the molecule with (b) a maleimide group-containing monocarboxylic acid, (d) an organic polyisocyanate compound, (e) a tetracarboxylic dianhydride, and (f) a hydroxyl group-containing (meth)acrylate as the optional component, and (B) a diluent. |
