| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which excels in photosensitivity, excels in the flexibility and soldering heat resistance, resistance to heat deterioration, and electroless gold plating resistance of cured products, can be developed with an organic solvent or a dilute alkali solution, and is suited in use for solider resists and interlaminar insulating layers. SOLUTION: The resin composition comprises (A) an ethylenically unsaturated group-containing polycarboxylic acid resin, (B) a maleimide compound, and (C) a diluent. |
