发明名称 PATTERN FORMING MATERIAL AND PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a good pattern shape when a resist pattern is formed using light for exposure having a wavelength of 1 nm band to 30 nm band or of 110 nm band to 180 nm band. SOLUTION: A pattern forming material having a polymer containing a first unit of formula 1 and a second unit of formula 2 and an acid generator is applied on a substrate to form a resist film. In the formulae, R1 and R2 are the same or different and each alkyl or Cl- or F-containing alkyl; R3 is a protective group which is released by an acid; and (m) is an integer of 0-5. The resist film is patternwise exposed by irradiation with light for exposure having a wavelength of 1 nm band to 30 nm band or of 110 nm band to 180 nm band and the patternwise exposed resist film is developed to form the objective resist pattern.
申请公布号 JP2002311588(A) 申请公布日期 2002.10.23
申请号 JP20010112174 申请日期 2001.04.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KISHIMURA SHINYA;ENDO MASATAKA;SASAKO MASARU;SHIRAI MASAMITSU;KADOOKA MASAHIRO
分类号 C08F212/14;G03F7/004;G03F7/039 主分类号 C08F212/14
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