| 发明名称 |
Improvements in or relating to semiconductor devices |
| 摘要 |
A leadframe for use with semiconductor circuits comprising a chip mount pad; a plurality of leadframe segments, separated from said mount pad by a gap; and a plurality of adhesive surfaces, positioned such that they provide attachment for bonding wires to be extended over said gap. <IMAGE> |
| 申请公布号 |
EP1017099(A3) |
申请公布日期 |
2002.10.23 |
| 申请号 |
EP19990204445 |
申请日期 |
1999.12.21 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ZUNIGA, EDWARD R.;OZAWA, TOSHIYUKI |
| 分类号 |
H01L23/12;H01L21/60;H01L23/495;H01L23/498 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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