COOLING UNIT USING THERMOELECTRIC SEMICONDUCTOR

摘要

PURPOSE: A cooling unit using a thermoelectric semiconductor is provided to make various articles cool by forming an additional cooling body having a reception room. CONSTITUTION: A plurality heat-sink pins(42) are formed in a heat-sink plate. The heat-sink plate is installed in a heat-sink. A thermoelectric device(20) is formed at a front end portion of the heat-sink(40). A refrigerator(100) having a cooling body(80) is formed in front of the thermoelectric device(20). The cooling body(80) includes a reception space(81) which is formed by a material having high thermal conductivity such as aluminium. Articles of the reception space(81) are cooled by the cooling body(80). The heat-sink(40) is used for emitting the heat. The heated air is discharged by a heat-sink fan(43). A thermal sensor is installed at one side of the cooling body(80).