发明名称 Methods of forming thin films by atomic layer deposition
摘要 Methods of forming thin films include forming a first layer comprising a first element that is chemisorbed to a surface of a substrate, by exposing the surface to a first source gas having molecules therein that comprise the first element and a halogen. A step is then performed to expose the first layer to an activated hydrogen gas so that halogens associated with the first layer become bound to hydrogen provided by the activated hydrogen gas. The first layer may then be converted to a thin film comprising the first element and a second element, by exposing a surface of the first layer to a second source gas having molecules therein that comprise the second element.
申请公布号 US6468924(B2) 申请公布日期 2002.10.22
申请号 US20010871430 申请日期 2001.05.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE SEUNG-HWAN;KIM YEONG-KWAN;KIM DONG-CHAN;PARK YOUNG-WOOK
分类号 H01L21/20;C23C16/34;C23C16/40;C23C16/44;C23C16/455;H01L21/318;(IPC1-7):H01L21/31 主分类号 H01L21/20
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