发明名称 |
Plated non-conductive products and plating method for the same |
摘要 |
Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight %; and executing electroless plating on a surface of the coating film. Also provided are products produced by this method.
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申请公布号 |
US6468593(B1) |
申请公布日期 |
2002.10.22 |
申请号 |
US19980200658 |
申请日期 |
1998.11.25 |
申请人 |
KANTO KASEI CO., LTD.;TANABE CHEMICAL INDUSTRY CO., LTD. |
发明人 |
IIZAWA TSUTOMU;ISHIDA TAKUYA;MURAYAMA TAMOTSU;YAGI TAKAYUKI |
分类号 |
H01B1/20;H05K1/09;H05K3/24;(IPC1-7):B05D1/18;B05D1/36;C25D5/54;C25D5/56 |
主分类号 |
H01B1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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