发明名称 Plated non-conductive products and plating method for the same
摘要 Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight %; and executing electroless plating on a surface of the coating film. Also provided are products produced by this method.
申请公布号 US6468593(B1) 申请公布日期 2002.10.22
申请号 US19980200658 申请日期 1998.11.25
申请人 KANTO KASEI CO., LTD.;TANABE CHEMICAL INDUSTRY CO., LTD. 发明人 IIZAWA TSUTOMU;ISHIDA TAKUYA;MURAYAMA TAMOTSU;YAGI TAKAYUKI
分类号 H01B1/20;H05K1/09;H05K3/24;(IPC1-7):B05D1/18;B05D1/36;C25D5/54;C25D5/56 主分类号 H01B1/20
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