Plastic molding compound, composite body, and filler for a plastic molding compound

摘要

An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by a condensation process, which may be conductive or insulating. It is also possible to provide the chip with a sheathing which has such fillers.