发明名称 LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device with which the shape of a hole is machined in a desired shape. SOLUTION: A variable wavefront means 3 which is composed of a polarized beam splitter 4, a quarter wavelength phase shift means 5, a lens 6, a mirror 7, and a moving means 8 for the mirror 7, is arranged between a laser oscillator 1 and an aperture 10. The degree in which the conversion and diversion of the laser beam which returns from the lens 6 to the quarter reflection plate 5 varies, i.e., the degree in which the conversion and diversion of light with which the aperture 10 is irradiated varies by moving the mirror 7. Thus, the beam mode at a machining face (in the vicinity of an image formation face) can be formed in various shapes such as, a nearly uniform hat-top shape and a Gaussian shape the center of which is stronger that the peripheral part.</p>
申请公布号 JP2002307184(A) 申请公布日期 2002.10.22
申请号 JP20010115432 申请日期 2001.04.13
申请人 HITACHI VIA MECHANICS LTD 发明人 MORI SADAO;SUGAWARA HIROYUKI;AOYAMA HIROSHI
分类号 G02B5/10;B23K26/06;B23K26/073;H01S3/00;H01S3/10;(IPC1-7):B23K26/06 主分类号 G02B5/10
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