| 发明名称 |
Method and apparatus for multiphase chemical mechanical polishing |
| 摘要 |
The present invention is a method and apparatus for CMP processing that reduces scratching of the insulating film and conductor lines of a wafer. More specifically, the method and apparatus introduce an aqueous solution to the polishing pad and wafer during various intervals of the polishing procedure.
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| 申请公布号 |
US6468135(B1) |
申请公布日期 |
2002.10.22 |
| 申请号 |
US19990302639 |
申请日期 |
1999.04.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CRUZ JOSE L.;HUYNH CUC K.;WALKER DAVID L. |
| 分类号 |
B08B1/04;B08B3/02;B08B3/08;B24B37/04;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B08B1/04 |
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