发明名称 Mounting structure and mounting method for surface acoustic wave element
摘要 A functional surface of a surface acoustic wave element is disposed to face a mount surface of a circuit board on which the surface acoustic wave element is to be mounted. A gap between the functional surface and the mount surface is sealed off by an anisotropic conductive resin while an oscillation space is maintained between an oscillation transmitting area of the functional surface and the mount surface. The oscillation space is constituted by a space that is formed by the anisotropic conductive resin. A mounting structure of the surface acoustic wave element is compact, is inexpensive, and has high reliability.
申请公布号 US6467139(B1) 申请公布日期 2002.10.22
申请号 US20000614145 申请日期 2000.07.11
申请人 NEC CORPORATION 发明人 TANAKA KEI
分类号 H01L21/60;H03H3/08;H03H9/05;H03H9/25;(IPC1-7):H05K3/32 主分类号 H01L21/60
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