Flip-chip transition interface structure

摘要

A flip-chip transition interface structure is suitable for use in high speed applications that require low return losses. The transition interface includes a conductive signal element and two conductive reference elements formed on a flip-chip die substrate. A signal solder bump is located at a signal bond pad formed at an end of the conductive signal element, and a reference solder bump is located at each conductive reference element. The conductive elements are configured to form a substantially round cutout region surrounding the signal bond pad. The positions of the solder bumps on the respective conductive elements are selected in a manner that enhances the impedance matching of the transition interface structure.