Conductive interconnect structures and methods for forming conductive interconnect structures

摘要

Interconnect structures and methods for making interconnect structures are disclosed. A typical interconnect structure has a tapered first end portion having a first substantially planar surface and a concave surface adjacent to the first planar surface. A second end portion of the interconnect structure includes a second substantially planar surface. The second planar surface has a larger area than the first planar surface. An intermediate portion is disposed between the first end portion and the second end portion.