发明名称 |
Method of automatically identifying and skipping defective work pieces for wire-bonding operation |
摘要 |
A method of automatic identifying and skipping defective work pieces mainly utilizes a reject eye formed inside the die covering area on a substrate to automatically determine whether the skipping procedure is triggered or not. The method of the present invention comprises the steps of: finding and aligning the die eye of the die as well as the lead eye of the substrate; finding the reject eye when the die eye and the lead eye is evaluated as not being present; stopping the wire bonding operation and skipping to next work piece when the reject eye is located. The method of present invention is capable of automatically determining whether the skipping procedure is triggered or not thereby reducing operating down time and increasing throughput.
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申请公布号 |
US6468813(B1) |
申请公布日期 |
2002.10.22 |
申请号 |
US20000561905 |
申请日期 |
2000.05.01 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHAO TE TSUNG;FANG HUI CHIN |
分类号 |
H01L21/00;H01L23/544;(IPC1-7):H01L21/00;H01L23/495;H01L21/48 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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