| 摘要 |
<p>PURPOSE: A semiconductor package and a semiconductor package mounting method are provided to be capable of simply verifying the direction of a semiconductor package before mounting. CONSTITUTION: One corner(4a) of a square shaped display section(4) provided on the surface of a semiconductor package body(2) is chamfered such that the chamfer dimensions are different from those of the other corners of the square shaped display section(4). If image recognition by a camera determines that the chamfered part is located correctly, the orientation of a semiconductor package(1) is determined to be correct. On the other hand, if the image recognition determines that the chamfered part is not located correctly, the orientation of the semiconductor package(1) is adjusted until the chamfered part is corrected, so that the direction of the semiconductor package(1) is simply verified, thereby improving work efficiency.</p> |
