WIRE BONDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND BALL FORMATION METHOD OF WIRE USING THE SAME

摘要

PURPOSE: A wire bonding apparatus for a semiconductor package and a ball formation method of a wire using the same are provided to easily achieve balls of uniform and small size by forming the ball at the end point of a conductive wire using a laser. CONSTITUTION: The wire bonding apparatus comprises a transducer(13) for transmitting ultrasonic energy, a capillary(14) formed at one end of the transducer for connecting a conductive wire(20) to I/O pads of semiconductor chips and circuit patterns of a substrate, and a ball formation part(15) for forming a ball(21) to one end of the conductive wire(20). The ball formation part(15) further includes a laser output part(15a) for outputting a laser into the one end of the conductive wire(20) and a laser generating part(15b) for applying the laser into the laser output part(15a).