METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for fabricating a semiconductor package is provided to adhere correctly a semiconductor chip on a predetermined position of a chip loading region by maintaining an aligning position between the semiconductor chip and the chip loading region. CONSTITUTION: A transfer portion guides a transferring operation and a stopping operation of a member(22). A driving portion transfers and adheres a semiconductor chip(20) to a chip loading region(24) of the member(22). A sense portion senses correctly an aligning position of the semiconductor chip(20) and compensates the error. A camera(12) of a vision system is installed at die bonder equipment(10). The camera(12) is located on an upper side of the semiconductor chip(20) transferred to a pickup tool(14). An X-ray examination system is used as the vision system.