| 摘要 |
PURPOSE: A deflash system of a semiconductor package is provided to eliminate resin bleed and flash, by performing a deflash process without using a chemical method or mechanical method. CONSTITUTION: A plurality of supporting bars(110) support a base frame(100). A vision unit(120) inspects the exterior view of at least one semiconductor package molded on a leadframe, separated from the upper surface of the base frame by a predetermined height. A laser generating unit(130) has a safety cover(131), installed in the upper portion of the base frame while being separated from the vision unit by a predetermined distance. The first particle removing unit(200) removes the particles left on the semiconductor package of the leadframe after a deflash process, installed in the upper portion of the base frame while being separated from the laser generating unit by a predetermined distance. A transfer unit(400) transfers the semiconductor package inspected by the vision unit to the laser generating unit and the first particle removing unit together with the leadframe. A control unit compares the data of the exterior view of the semiconductor package inspected by the vision unit with the previously-stored data of the exterior view of a sample semiconductor package. The control unit controls the laser generating unit so that only the badly molded semiconductor package can be deflashed.
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