| 摘要 |
PURPOSE: A guide rail apparatus of semiconductor package singulation system is provided to prevent bad process beforehand by monitoring the ordering state of semiconductor package with photo sensors during the transporting the package from a cutting device to an unloading device. CONSTITUTION: A guide block(110) installed next to a die(200) is composed of the first transporting part(112) and the second transporting part, to each of which the singulation package is sent through walking beam(130) and on each of which, holes for photo emission sensors(112a,113a) and photo detection sensors(112b,113b) are formed so that each pair of photo sensors installed in the holes senses the existence of package on top surface of the walking beam. The photo sensors are connected to the system controller, taking follow-up measures in case of observing any problem of the transported package.
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