发明名称 |
WIRE BONDER WORK BUMPING AND COINING AT THE SAME TIME |
摘要 |
PURPOSE: A wire bonder work bumping and coining at the same time is provided to reduce the processing time and cost and improve productivity by supplying a tool having both bumping and coining device connected to a single transducer. CONSTITUTION: A wire bonder is made up of a transducer(100) containing an ultra sonic generator(120) serving as source of ultrasonic waves and a transducer horn transferring ultrasonic waves to the pointed end. A tool-fixing part(200), having two holes in it, is attached to the pointed end of the transducer horn. Both bumping tool(20) and coining tool are installed in the tool-fixing part. |
申请公布号 |
KR20020079014(A) |
申请公布日期 |
2002.10.19 |
申请号 |
KR20010019558 |
申请日期 |
2001.04.12 |
申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
DO, WON CHEOL;LEE, SEUNG JU;SHIN, WON DAE |
分类号 |
H01L21/607 |
主分类号 |
H01L21/607 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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