发明名称 WIRE BONDER WORK BUMPING AND COINING AT THE SAME TIME
摘要 PURPOSE: A wire bonder work bumping and coining at the same time is provided to reduce the processing time and cost and improve productivity by supplying a tool having both bumping and coining device connected to a single transducer. CONSTITUTION: A wire bonder is made up of a transducer(100) containing an ultra sonic generator(120) serving as source of ultrasonic waves and a transducer horn transferring ultrasonic waves to the pointed end. A tool-fixing part(200), having two holes in it, is attached to the pointed end of the transducer horn. Both bumping tool(20) and coining tool are installed in the tool-fixing part.
申请公布号 KR20020079014(A) 申请公布日期 2002.10.19
申请号 KR20010019558 申请日期 2001.04.12
申请人 AMKOR TECHNOLOGY KOREA, INC. 发明人 DO, WON CHEOL;LEE, SEUNG JU;SHIN, WON DAE
分类号 H01L21/607 主分类号 H01L21/607
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