| 摘要 |
PURPOSE: A method is provided to reduce manufacturing costs by using a new composition and simplifying the process of compression. CONSTITUTION: A method comprises the first step of forming the first layer polyimide substrate of a multi-layer board(1) by using a polyimide(111), forming a circuit layout(112) having a narrow pitch on the first layer polyimide substrate, and forming a solder pad(113) at the bottom surface of the first layer polyimide substrate by permitting the circuit layout to be directed toward the bottom surface of the first layer polyimide substrate; the second step of forming the second layer of a non-high density organic substrate using an organic material, forming a circuit(1231) by mounting a conductive layer(123) at both sides of a core substrate(122), soldering the polyimide substrate disposed on the top of the layout of the circuit with a solder bump(125), permitting the circuit to have a path(1221) which passes through the core substrate and reaches the conductive layer arranged at the bottom of the non-high density organic substrate, and distributing the circuit and lowering circuit density; and the third step of soldering and electrically connecting the first layer polyimide substrate, second layer, non-high density organic substrate, solder bump and the bottom surface of the first layer polyimide substrate.
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