| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin wafer hand, with which dust will not occur, capable of moving into a wafer cassette, without contact to wafers horizontally stored over multiple stages. SOLUTION: By using a numerically controllable motor for the driving part of a crimping claw to be operated as a means for solving problems, an arm equipped with the crimping claw is attached to the rotary shaft of the motor and the wafer is crimped by turning the arm. In such a system, the driving part of the device is further covered with a cover having a suction port and the outflow of dust into a clean room is prevented. |
