| 摘要 |
PROBLEM TO BE SOLVED: To improve heat radiation properties in a semiconductor device. SOLUTION: A heat spreader 2, where a semiconductor chip 1 is packaged, is exposed from a sealing body 5, a joining means 9 is mounted to a portion where the exposed portion is overlapped to one portion of a heat radiation fin 10, and the heat radiation fin 10 is fixed detachably. |
