| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame, in which the electrode pads of an electronic component and leads of the lead frame can be bump-connected easily, without bringing the adjacent leads into contact, when pitches of the electrode pads of the electronic component such as a semiconductor chip or the like are smaller than 200μm and, even if the pitches of the electrode pads are preferably small at about 100 to 110μm, and to provide an electronic apparatus provided with the lead frame. SOLUTION: The semiconductor chip 95, on which a plurality of electrode pads 96, and so on are installed is mounted on the lead frame. In the lead frame, a plurality of leads 5 whose ends on one side are connected to the electrode pads 96 are formed, insulation materials 7 are attached and formed on faces on both sides or faces on one side of the leads 5, by excluding at least parts connected to the electrode pads 96, and lead separation means 8 which are used to prevent the adjacent leads 5, 5 from coming into contact are installed at the insulation materials 7. |
