| 摘要 |
PROBLEM TO BE SOLVED: To reduce deflection of a printed wiring board. SOLUTION: A glass woven fabric 21 which is a glass reinforcing material is impregnated with a resin, which is heated and dried to provided a pre-preg 5. The pre-preg 5 is provided above and below an inner-layer core material 3, and a copper foil 7 is arranged outside the pre-preg 5. Two layers of copper- plated lamination plates 11 with a circuit are provided to the inner layer core material 3. This is pressurized under heat, worked for circuit, and SVH-boring is performed with laser, to provide a multi-layer buildup wiring board 9. A film 13 with a copper foil 7 is provided on both sides of the multi-layer buildup wiring board 9. This is pressurized under heat, worked for circuit, and SVH- bored with laser, to provide a printed wiring board 1. The elasticity of the printed wiring board 1 is improved by the pre-preg 5 containing glass reinforcing material. |
